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SDPpotting EC 1020

DIELECTRIC RESIN

The SDPpotting EC 1020 system is a rigid, two-component polyurethane resin with a Shore D 80 hardness, used to encapsulate, protect, and immobilize electronic components on a board or in a housing. The main functions of the SDPpotting EC 1020 system are: • Mechanical protection against shocks and vibrations. • Electrical insulation that secures the circuit and prevents short circuits. • Protection against humidity and corrosion of electronic components. • Temperature resistance.
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Applications SDPpotting EC 1020

The SDPpotting EC 1020 system is a rigid, two-component dielectric polyurethane resin used to encapsulate, protect, and immobilize electronic components on a board or in a housing.

The main function of the SDPpotting EC 1020 system is 

  • Mechanical protection against shocks and vibrations
  • Electrical insulation that secures the circuit and prevents short circuits
  • Protection against humidity and corrosion of electronic components
  • Temperature resistance


The SDPpotting EC 4920 system has the following main characteristics

  • Very low reaction exotherm
    • No damage to components, ideal for thick parts
  • Very low shrinkage upon curing: maintains circuit integrity
  • Excellent electrical insulation
  • Excellent resistance to humidity and chemicals
  • Shore A 80 hardness
    • Good resistance to shocks and vibrations


The SDPpotting EC 4920 system is a two-component product intended for implementation via a low-pressure casting machine or manually, depending on the application.

The SDPpotting EC 4920 Polyol is a composition based on polyether and polyester polyols, and 100% reactive catalysts.

The isocyanate is a modified MDI.

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